Total 6 Senior Executive process improvement manager job vacancies

About STMicroelectronics

At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products,solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027.

Further information can be found at www.st.com

YOUR ROLE 

1. Set-up process recipe of newly setup process equipment.
2. Perform qualification for new process equipment and new process recipe.
3. Evaluate the new processes and make a series of process characterization.
4. Perform inline troubleshooting and qualification in daily operation.
5. Follow Gemba activity to identify opportunity of improvement in operation and quality aspects.

YOUR SKILLS & EXPERIENCES

• Degree in engineering of materials, chemistry
• Knowledge of excel, office suite.
• English language proficiency
• at least 5 years experience in wafer fab process engineering, and having at least 3 years experience in DCVD process; preferred experienced in DCVD process tool type in Applied materials Centura and Producer.
• Strong CVD process technical knowledge background, with experience to develop and optimize new process recipe
• Master SPC, FMEA and 8D problem solving methodology.

Process Set-up & Optimizations
a) Lead Engineers to set-up metrology recipe of newly introduced processes or new metrology/ process equipment or tools. Evaluate the new measurement processes and make a series of measurement characterization.
b) Conduct appropriate equipment, tools and measurement qualification.
c) Study the measurement recipe robustness window vs the existing process and introduce the best fact-based measurement methodology. Provide technical support on measurement quality or process standardization for product/process industrialization.
d) Lead and drive Continuous Improvement Program.
e) Drives work methods improvement and innovation to develop new techniques and new methods on his/her technical field.

Equipment Management
a) Manage equipment failure through Statistical Process Control (SPC). Provide analysis to identify specific equipment failure mode for the maintenance team to work.
b) Perform appropriate equipment qualification after every maintenance intervention.
c) Perform FMEA on all critical process &/or machine whenever it is required.
d) Work closely with the maintenance management to ensure maximum possible up-time.
e) Setup/ Improve predictive maintenance system when it is required

Manufacturing Line Support
a) To lead & motivate a team of Engineers to provide day to day support in the manufacturing of the products.
b) Analyze production problems and determine solutions through liaising with all parties involved, and through studying past cases.
c) Define more user-friendly tools, process specifications, clear procedures & TPM. Support the OJT activities by providing proper and updated process specifications.
d) Provide technical training to both process and EES team.
e) Ensures the problem solving for complex (line stop or high risk of return lost) or unknown problems and ensure communication.
f) Identifies and evaluates crisis situations, ensures the relevant reporting and takes containment actions.

Automation, Robustness & Continuous Improvement
Work with DTIT and drive for automation solutions for robust manufacturing operation mandatory WSO controlled qualification procedures, e-Star alarm monitoring and interlock, while quality and speed are not compromised.

Documentation & Procedures
a) Ensure all processes are documented with properly written and clearly defined procedures in an electronic media.
b) Update and maintain all line specifications electronically to align with the existing working process.

YOUR SKILLS & EXPERIENCES

• Bachelor Degree in Engineering
• Minimum 10 years of working experiences in Metrology Process
• Metrology Tools Type Expertise in Thin Film, Trench, Critical Dimension, XRF, FTIR, Stress and Resistivity.  
• Technology Transfer Experiences, with Fab-Specific Metrology Tools, Measurement Systems, and Applications.
• Cross Functional Support in leading team with Quality, Technology, Device, and other Module to achieve common goal in terms of quality, service and cost.
• Training Tools and Certification (Example: JMP, FMEA, DOE and 8D)
• SPC Knowledge - Collaborate with process/equipment owner on maintaining / improving Statistical Process Control (SPC) KPI (OOC, Drift, CpK, control limit management.
• Quality Knowledge - Implement Best Known Method (BKM) for overall quality control system through benchmarking.

About STMicroelectronics

At ST, we are 48,000 creators and makers of semiconductortechnologies mastering the semiconductor supply chain with state-of-the-artmanufacturing facilities. An integrated device manufacturer, we work with morethan 200,000 customers and thousands of partners to design and build products,solutions, and ecosystems that address their challenges and opportunities, andthe need to support a more sustainable world. Our technologies enable smartermobility, more efficient power and energy management, and the wide-scaledeployment of cloud-connected autonomous things. We are on track to be carbonneutral in all direct and indirect emissions (scopes 1 and 2), producttransportation, business travel, and employee commuting emissions (our scope 3focus), and to achieve our 100% renewable electricity sourcing goal by the endof 2027.

Further information can be found at www.st.com

YOUR ROLE 

​As a Senior Wets Process Development Engineer, you will be the technical anchor for our end-to-end wet process portfolio. You will be responsible for the following:

• ​Process Architecture: Lead the design and optimization of advanced plating processes (including NiPdAu/ENEPIG), wet etching, resist stripping, and precision cleaning modules.
• ​Root Cause Analysis: Tackle complex, localized process defects—such as thickness non-uniformity or interfacial passivation—using advanced analytical tools (SEM/EDX, AFM).
• ​Technology Scaling: Drive the transition of new wet processes from initial lab-scale concepts to robust, high-volume manufacturing (HVM) readiness.
• ​Chemical Innovation: Evaluate and integrate next-generation chemistries, including the management of complex stabilizer systems and additive interactions to improve process margins.
• ​DOE Leadership: Design and execute sophisticated multi-variate experiments to isolate variables in electrochemical reactions and surface preparation.
• ​Cross-Functional Integration: Collaborate with Lithography, PVD, CVD, R&D, and Assembly teams to ensure seamless process compatibility across the entire device fabrication flow.

YOUR SKILLS & EXPERIENCES

We are looking for a seasoned expert who combines hands-on laboratory discipline with a deep theoretical understanding of wet bench dynamics.

​Requirements:

• ​Education: Minimum Bachelor’s Degree in Chemical Engineering, Materials Science, Chemistry, or a related Engineering discipline.
• ​Experience: 5 to 10 years of direct experience in semiconductor process development, with a heavy emphasis on wet station technologies.
• ​Wet Process Mastery: * Proven track record in Electroless and Electrolytic plating (experience with NiPdAu chemistry and stabilizer management is a significant plus).
• Deep expertise in Wet Etching and Wafer Cleaning (SC1/SC2, SPM, and advanced solvent chemistries).
• ​Hands-on experience with Resist Stripping and surface preparation for advanced packaging or Front-End-Of-Line (FEOL) applications.
• ​Analytical Rigor: Proficiency in Design of Experiments (DOE) and Statistical Process Control (SPC). ​Ability to interpret complex material characterization data to identify chemical stratification or surface poisoning issues.
• ​Soft Skills: Strong communication skills to present R&D findings to stakeholders and the "grit" to solve challenges.

About STMicroelectronics

At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products,solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027.

Further information can be found at www.st.com

YOUR ROLE 

As a Senior Process Engineer, you will be the technical owner of the Electro‑Chemical Plating (ECP) copper process on the LAM Novellus SABRE platform. You will drive process development and sustaining activities, working closely with equipment engineering to characterize hardware, resolve complex issues, and continuously improve process robustness, yield, and overall tool performance.

• Develop, optimize, and sustain ECP Cu reinforcement / damascene fill processes on Novellus SABRE tools.
• Define and tune recipes and hardware configurations to achieve target thickness, uniformity, fill performance, and defect levels.
• Collaborate with PVD barrier/seed and integration teams to ensure strong linkage between upstream processes (Ti, TiN, CVD‑TiN, Cu seed, etc.) and downstream ECP performance.
• Perform structured hardware and process characterization, including experiments on flow, contact design, waveform, and chemistry conditions.
• Lead troubleshooting and excursion management, conduct systematic root‑cause analysis, and implement permanent corrective and preventive actions.

YOUR SKILLS & EXPERIENCES

• Bachelor’s or Master’s degree in Electrical/Electronic Engineering, Microelectronics, Materials Science, Applied Physics, Chemical or Mechanical Engineering, or a related discipline.
• Min 5 years of hands‑on experience with ECP copper processes on LAM Novellus SABRE systems in a semiconductor fab environment.
• Solid knowledge of semiconductor manufacturing, vacuum technology, and thin‑film deposition, including PVD barrier/seed fundamentals.
• Strong collaboration and communication skills: able to document and present findings clearly through technical reports, reviews, and data summaries; active participation in cross‑functional forums and project teams.
• Proven problem‑solving capability, including advanced root‑cause analysis, failure‑mode identification, and implementation of robust, sustainable solutions.

About STMicroelectronics

At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products,solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027.

Further information can be found at www.st.com

YOUR ROLE 

As a Senior Process Engineer, you will be the technical owner for tungsten deposition and etch‑back processes, with a primary focus on W deposition on the Novellus Altus platform. You will work closely with equipment engineers to characterize hardware, resolve complex issues, and continuously improve process stability, capability, and yield.

Responsibilities

• Develop, sustain, and optimize CVD tungsten, WALD, and tungsten etch-back processes, focusing on Pulsed Nucleation Layer (PNL) tungsten on Novellus Altus
• Drive hardware and recipe characterization on Altus systems to improve film uniformity, reduce defects, and enhance tool productivity
• Perform structured troubleshooting and root-cause analysis to resolve process excursions and chronic issues
• Correlate process conditions with film properties and device performance using structural, electrical, and reliability data
• Collaborate with integration, device, yield, equipment teams, and vendors to support technology transfers and new node ramp-up

Job Requirements

• Degree in Electrical & Electronics, Microelectronics, Material Science, Applied Physics, Chemical, or Mechanical Engineering
• Minimum 5 years of experience in Thin Film Tungsten process on Novellus Altus system
• Strong fundamentals in thin-film deposition, especially CVD W / WALD, nucleation, and etch-back mechanisms
• Effective collaboration and communication skills

Company Overview

At STMicroelectronics, we are 50,000 creators and makers of semiconductor technologies mastering the supply chain with advanced manufacturing. Our Singapore operations include manufacturing, R&D, design, sales, and supply-chain management with about 4,900 employees.

Job Summary

Join STMicroelectronics to operate and optimize photolithography and bonding processes, drive process improvements, and collaborate across teams to advance semiconductor manufacturing technologies.

Responsibilities

• Operate and optimize ASML i-Line Stepper Systems by defining and tuning process recipes including focus, exposure dose, and alignment to ensure precise photolithography outcomes
• Perform routine process monitoring and troubleshooting on ASML i-Line steppers, including tool qualification, SPC tracking, and defect analysis to maintain stable and repeatable process performance
• Analyze process and metrology data to identify improvement opportunities, conduct root-cause analysis, and implement corrective and preventive actions (CAPA) to enhance yield, throughput, and process stability
• Assist in developing, characterizing, and optimizing photolithography, screen printing, and bonding processes within semiconductor manufacturing environments, including MEMS technology development
• Monitor and control manufacturing processes to ensure consistent, high-quality output and promptly troubleshoot issues with effective corrective actions
• Maintain detailed documentation of process parameters, experiments, and results, and prepare technical reports and presentations to communicate findings and recommendations to engineering teams
• Update process documentation and standard operating procedures (SOPs) to reflect process changes and improvements
• Collaborate closely with cross-functional teams including R&D, production, and quality assurance to integrate photolithography, screen printing, and bonding processes seamlessly
• Participate actively in team meetings and problem-solving discussions, providing support to shift engineers and technicians as needed
• Engage in continuous improvement initiatives to enhance process efficiency, yield, and quality, including identifying and implementing opportunities for process automation

Preferred competencies and qualifications

• Bachelor’s degree in Electrical & Electronics, Mechatronics, Physics/Applied Physics, Materials Science, Chemical, or Mechanical Engineering
• Understanding of photolithography or bonding principles and semiconductor processes
• Knowledge of EKRA printing and bonding processes considered an advantage
• Experience with photolithography equipment such as Track (DNS/TEL), Stepper (Canon/ASML), and Aligner (EVG/SUSS)
• Hands-on experience with screen printing (EKRA) and bonding (EVG) equipment
• Knowledge of data analysis and statistical process control
• Effective communication and teamwork skills
• Ability to work independently and manage multiple tasks effectively