Total 8 job vacancies by Bitmain Development Pte. Ltd.

Responsibility

1. Responsible for algorithms and logic design and verification related to ASIC/AI/CPU chips under advanced processes.

2. Responsible for chip testability design and related work.

3. Responsible for maintaining the IC development environment and tool processes for chips, as well as designing In-House EDA tools.

Requirement

1. Recent graduates or those who graduated within the past year with a bachelor's degree or higher in fields including but not limited to Mathematics, Physics, Electronic Science and Technology, Microelectronics, Information and Communication Engineering, Computer Science and Technology, or Materials Science and Engineering.

2. Excellent academic performance, with a strong curiosity, learning ability, and knowledge transfer capability in new areas and related professional fields.

3. Understanding of the IC development process, with a certain theoretical foundation in digital circuits, practical skills, and innovation ability.

Responsibility

1. Responsible for the customization and performance/yield analysis of devices using advanced processes.

2. Responsible for parameter extraction and modeling for advanced processes.

3. Job tasks include but are not limited to device performance analysis, test key design, process simulation, transistor-level circuit simulation, and yield data analysis.

Requirement

1. Recent PhD graduates or those who graduated within the past year with a PhD from fields including but not limited to Mathematics, Physics, Electronic Science and Technology, Microelectronics, Information and Communication Engineering, Computer Science and Technology, or Materials Science and Engineering.

2. Good foundational knowledge of semiconductor device physics, integrated circuit design, and manufacturing.

3. Familiar with advanced process technology and strong scripting skills are preferred.

4. Excellent academic performance, with a strong curiosity, learning ability, and knowledge transfer capability in new areas and related professional fields.

Responsibility

1. Responsible for the physical design of advanced process digital ASIC/AI/CPU chips, layout design of analog/digital chips, PPAC optimization under advanced processes, fully custom design, and exploration of new technologies in advanced packaging.

2. Multiple tasks including but not limited to: back-end physical implementation from gate-level netlist to GDSII, layout design of digital/analog chips, including PR, PV, IR signoff, PPAC optimization, and STA/Spice signoff.

Requirement

1. Recent graduates or those who graduated within the past year with a bachelor's degree or higher in fields including but not limited to Mathematics, Physics, Electronic Science and Technology, Microelectronics, Information and Communication Engineering, Computer Science and Technology, or Materials Science and Engineering.

2. Excellent academic performance, with a strong curiosity, learning ability, and knowledge transfer capability in new areas and related professional fields.

3. Understanding of the IC development process, with a certain theoretical foundation in digital circuits, practical skills, and innovation ability.

Responsibility

1. Maintain and develop relationships with new and existing customers, complete product sales, collections, and shipments, ensuring sales targets are achieved.

2. Collaborate with other business departments to achieve performance goals, provide comprehensive services to customers, and promote the construction of a full industry ecosystem, such as collecting and organizing global authorized repair site and cooperation intention with franchise repair sites, participating in influential industry summits, and providing customized product services and collaborations.

3. Proactively learn about product information, understand competitor dynamics, and maintain market sensitivity.

4. Establish and promote a positive image and value of the brand in the industry, continuously enhancing brand competitiveness.

Requirement

1. Bachelor’s degree or higher, any major is acceptable; experienced in student organizations is preferred.

2. Good appearance and demeanor, with strong communication and problem-solving skills, result-oriented.

3. Strong collaboration and resilience under pressure, willing to do long-term business trip.

4. Fluent in English, with Chinese or English as a working language.

5. Study abroad experience, understanding and recognizing both Eastern and Western cultures.

6. Fluency in Spanish, Portuguese, Arabic, or French is a plus.

7. Preference given to local individuals from the U.S., Europe, or other Asian countries with study/work experience in China.

Responsibility

1. Responsible for the development, porting, optimization, and maintenance of firmware for Linux embedded systems, as well as the development of driver programs for peripheral modules.

2. Responsible for chip testing and driver development, as well as chip debugging and testing tasks.

3. Responsible for the development of software control algorithms related to power management.

Requirement

1. Bachelor's degree or higher in related fields including but not limited to Communications, Electronics, Computer Science, Automation, Mathematics, or Physics.

2. Clear logical thinking ability, strong learning capability, proactive attitude, and a sense of responsibility.

3. Familiar with Linux systems, with a foundational understanding of embedded software design and development, and strong C or C++ programming and debugging skills.

4. Understanding of embedded microprocessor principles, ability to read data sheets, and a background in hardware knowledge is preferred.

5. Familiar with common data structures and the ability to analyze and design algorithms.

Responsibility

1. Define analog and mixed-signal circuit modules, including technical specifications and detailed design plans.

2. Perform design optimization, simulation verification, and post-silicon testing of analog and mixed-signal circuits.

3. Provide guidance for layout planning and floorplan design.

Requirement

1. Experience in leading semiconductor companies (domestic or international) is preferred.

2. Solid foundation in analog circuit design; proficient in designing common analog circuits such as OPAMP, ADC, BGR, PLL, and LDO.

3. Expertise in one or more high-speed interface designs such as DDR, MIPI, Ethernet, PCIe, or SATA.

4. Experience with FinFET-node design and successful tape-out projects is a strong plus.

5. Strong sense of responsibility, ability to work independently, and excellent teamwork skills.

6. Experience in layout design is a plus.

Job Description:

• Responsible for analog/hybrid circuit program planning and design implementation, performance optimization, simulation verification and testing related work;
• Responsible for the design of high-performance, ultra-low voltage customized circuits under advanced technology. Targeting specific PPA requirements, able to select transistors, layout
• Effect analysis, unit logic merging and simplification, and starting from the underlying optimization thinking, deliver digital units or modules that can be integrated;
• Responsible for the physical design, analog/digital chip layout design of advanced technology digital ASIC/AI/CPU chips, and the exploration of new technologies such as PPAC optimization, fully customized design, and advanced packaging under advanced technology;
• Write various design documents and standardized materials, and implement the company's development processes, specifications and systems.
• Work tasks include but are not limited to:
• Commonly used analog chip or IP design, transistor-level circuit design and simulation, layout planning and design, timing library characterization extraction, SRAM custom design, etc.
• From gate-level netlist to back-end physical implementation of GDSII, digital/analog chip layout design, including PR, PV, IR Signoff, PPAC optimization, Sta/Spice Signoff, etc.;
• Chip design process development, In-House EDA tool development, chip yield tracking and optimization;

Requirements:

• Majors include but are not limited to mathematics/physics/electronic science and technology/microelectronics/information and communication engineering/computer science and technology/materials science and engineering fresh college students or overseas students within one year of graduation , master's degree or above;
• Excellent academic performance, strong curiosity, learning ability and knowledge transfer ability for new things and knowledge in professional and related fields;
• Understand the IC development process, and have a certain theoretical foundation and necessary capabilities of digital circuits as well as innovation capabilities.

Job Responsibilities

1.Conduct research and implement import & export compliance solutions for key Southeast Asian countries (e.g., Malaysia, Thailand, Indonesia, etc.);

2.Liaise with local customs authorities, assess the impact of regulatory changes on business operations, and develop corresponding mitigation strategies;

3.Manage third-party vendors including contract manufacturers, freight forwarders, and logistics providers to ensure stable, secure, and cost-effective transportation;

4.Collaborate with internal stakeholders (Procurement, Planning, Finance, etc.) to ensure accuracy and consistency of shipment information, optimize standardized processes, and improve operational efficiency;

5.Identify risks in customs and logistics operations, and support the improvement of contract templates and operational SOPs;

6.Oversee logistics vendors’ daily operations, including budget planning and invoice reconciliation, while continuously identifying cost optimization opportunities.

Requirements

1.Around 3 years of experience in overseas customs, logistics, or international trade (flexible for outstanding candidates);

2.Fluent in English (both spoken and written), with the ability to independently participate in business meetings and communicate with customs authorities;

3.Proficiency in Chinese as a working language is required; proficiency in Southeast Asian languages (e.g., Malay, Thai) is a plus;

4.Familiar with customs regulations, rules of origin, and customs valuation principles in major Southeast Asian countries, with the ability to quickly assess policy impacts;

5.Strong understanding of end-to-end logistics operations, including sea, air, and land transportation;

6.Willing to travel occasionally and demonstrates strong teamwork, ownership, and self-motivation;

7.Strong logical thinking and excellent cross-cultural communication skills.