Total 24 test engineer job vacancies in Hong Kong

We are seeking a highly skilled and innovative senior engineer to lead our technical team in bringing new products to market within a dynamic environment. In this role, you will lead and contribute to the development and implementation of advanced test engineering strategies for our cutting-edge storage products. Below are the key responsibilities:

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Optimize Test Strategies: Design and execute efficient test plans, test time, yield, and quality to meet factory financial goals. Identify cost-effective testing methods through troubleshooting, validation, and continuous improvement.
• Lead and Collaborate on Engineering Solutions: Lead and implement innovative engineering solutions while collaborating with cross-functional teams to ensure project success under competitive timeline.
• Champion Innovation and Cost Efficiency: Collaboratively integrate advanced testing technologies, research, and adopt cost-saving solutions like Test Time Reduction (TTR) and new test platforms, driving CAPEX reduction. Continuously improve test programs and test infrastructure to enhance product quality and reliability.
• Technical Expertise and Support: Provide leadership in electrical failure analysis (EFA), exploring new test method/EFA technique to address RMAs, production, reliability, and DPPM improvement. Analyze test results and deliver reports to stakeholders with actionable insights for improvement.
• Technical Communication and Documentation: Develop and deliver clear, concise technical reports and documentation, including EFA, work instructions, test equipment guidelines, test reports, and specifications.
• NPI Support: Lead NPI projects, ensuring smooth transfer of test technology to mass production.
• Knowledge Sharing and Mentorship: Mentor junior engineers, promote best practices, and facilitate knowledge transfer through technical training.
   

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Maximize wire bond process capability to handle wide range of product portfolio.
• Drive for Wire Bond process yield improvement and monitoring.
• Drive for Wire Bond related test QDN investigation and improvement plan.
• Drive for wire bond related improvement projects.
• Hand-sake with NPI team on new technology / product / wire bond methodology transfer to mass production.
• Liaise and work with equipment team on equipment related improvement and new machine qualification.
• Project management in project related to wire bond yield improvement, cost saving and process efficiency.

We are seeking a highly skilled and motivated Staff Engineer to join our Automation Development Engineering team. The ideal candidate will possess strong expertise in multi-system integration, equipment communication (SECS/GEM), .NET technologies (C# and VB), web services, database management (Oracle and SQL Server), and development tools such as TFS. You will collaborate closely with factory operations and internal IT teams to gather requirements, design and develop solutions, and ensure seamless deployment and support.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Design and develop automation applications to support factory operations.
• Analyze business challenges and deliver efficient, scalable solutions.
• Provide technical expertise to evaluate and implement cost-effective systems and procedures.
• Collaborate across departments to gather requirements and deliver solutions that emphasize reusability, scalability, and simplicity.
• Investigate and resolve operational issues, conduct root cause analysis (RCA), and implement preventive measures.
• Manage all phases of the Software Development Life Cycle (SDLC), ensuring thorough documentation and alignment with business needs.
• Work independently or as part of a team to execute tasks and projects assigned by project leads or managers.
• Provide Level-2 technical support to the 24/7 application support team.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Integrate assembly/test data pipeline, analyze and transform process data.
• Develop new process for NPI, transfer to HVM without major quality issues. 
• Analyze and optimize existing manufacturing processes to enhance efficiency and product quality.
• Develop and implement process improvement initiatives using methodologies such as Six Sigma and Lean.
• Design and conduct experiments to troubleshoot process issues and validate improvements.
• Develop and maintain factory automation applications with modern frontend tools.
• Develop and optimize Oracle SQL and Microsoft SQL Server queries for data access and reporting.
• Integrate factory systems and manufacturing equipment via web services, API calls, or SECS/GEM communication protocols.
• Collaborate closely with process, equipment, factory automation and IT teams to deliver robust and efficient automation, machine learning and AI solutions.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• 3D NAND test solution design, assessment, development, and maintenance, including hardware, software, and data analysis.
• R&D and MP program development on multiple platforms including Advantest T5773, T5831 series, & In house designed platforms.
• Test Equipment bring-up and correlation for new packages, including DSA design, pin & channel mapping.
• Product-specific flow creation and integration to meet HVM requirements.
• R&D activities from pre-silicon to post-silicon, including Design Validation, Engineering Evaluation, Qualification Support, and Failure Analysis.
• Engineering investigation and resolution on design/process/packaging issues. 
• RMA failure mode analysis and screen coverage improvements.
• Test data correlation between platforms. Yield enhancement and test time optimization.
• Collaboration internally across multiple departments, such as PE, Device, Packaging, and Design, as well as with external ATE vendors and related parties for debugging and related engineering activities.
• In-house designed platform and new test equipment validation, production environment setup.

ESSENTIAL DUTIES AND RESPONSIBILITIES: 

• Perform data mining and analytics for Quality Assurance (QA) in semiconductor Assembly & Testing processes
• Understand QA business workflows (e.g., SPC, 8D, defect management) and translate business needs into scalable data solutions
• Design and develop end-to-end data pipelines, including data ingestion, transformation, modeling, and visualization
• Develop analytical methods such as anomaly detection, trend analysis, and predictive modeling to enhance quality control
• Drive the transformation of quality management from manual processes to automated and intelligent systems
• Develop dashboards, reports, and automated QA-related business applications
• Collaborate with IT, data teams, and business stakeholders to integrate data platforms with operational systems
• Explore and implement AI/GenAI use cases in quality engineering, such as intelligent insights and automated reporting

• Providing technical leadership and expertise to define requirements for framework through programming/scripting of verification and emulation flows.
• Partnering with ASIC engineers to deploy and support framework for technologies like advanced verification environment configuration and management.
• Collaborating cross-functionally to optimize verification and emulation workflows and standardize methodologies.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Responsible on execution and analysis of NAND memory reliability qual and perform Failure Analysis.
• Designing and developing reliability sequences for given technology node in addition to performing actual reliability test execution followed by Failure Analysis to root cause the issues reported.
• Some of the other areas that this position will include will be: R&D support, DPPM improvement, test documentation, comprehension of design manuals and data sheets, using various bench equipment (oscilloscopes, logic analyzers, multimeter), and interacting with other engineering groups.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Represents Package Engineering in cross-functional teams and ensures that packages are characterized, qualified, and introduced into production in a timely manner while meeting all mechanical, electrical, performance, reliability, and quality requirements.        
• Lead cross-functional teams, factories, and other engineers while managing the entire package life cycle process.          
• Works with the Packaging R&D teams worldwide to develop and qualify new and emerging packaging technology required to support business needs
• Support assembly yield improvement and package cost reduction programs.  
• Lead new product from low volume to high volume production transition with yield and quality meeting goals. Ensure FMEA, SOD, Control Plan, recipe guideline, SPC and other assembly controls are ready prior to high volume production.
• Work on innovative ideas for best-in-class package design.