Total 1,361 system engineer job vacancies in Others category in Hong Kong

Job Responsibilities:

• Analyze SPC charts using SPACE. Know all the PR rules and their significance. Do proper annotation to maintain quality troubleshooting rate for SPC OOC. Understand Cp and Cpk indices.
• Analyze split lot, DOE data, ET, sort yield using JMP, Klarity ACE.
• Create SPC charts, DCOP and modify SLDB using PROMIS (Si-View).
• Upload recipe, check recipe and ensure recipe content compliance using RMS.
• Follow up on SPSR, MRB, 8D, TECN, or spec update with ECN. Provide guidance to junior Engineers.
• Setup and troubleshoot issues in recipes/ job files in all metrology tools within the Module.
• Analyze data from passed down to identify chronic process issues, establish improvement programs and lead engineers to resolve them. Establish CAS / procedures to be followed and work with other departments for resolution if required.
• Work as a team with both Equipment and Manufacturing Engineers to meet Module objectives. Drive team to meet key indices of Uptime and OEE as per the goals set for these indices.
• Take on leadership roles to drive a small cross functional task team to address yield improvement/ excursion issues.
• Facilitate/ initiate CIP programs to optimize process window, cost, yield, and productivity. Establish plans and strategies to optimize process capability to meet operational requirements.
• Resolve complex technical issues in own Module or yield related issues
• Follow up with cross-fab benchmarking activities to engage the best-in-campus practices across fabs.
• Self audit and update specifications / documentation to meet TS16949 Quality Standard requirements.

Requirements:

• Degree in Electrical / Electronics / Microelectronics / Chemical Process / Chemistry / Physics / Material Sciences / Mechanical
• Min 2 years of relevant work experience in Thin Film CMP Process and Wafer fabrication process.
• An excellent team player with good interpersonal, communication and written skills
• Strong logical thinking capability and good analytical skill
• High level of integrity with strong leadership attributes to lead and coach a team
• Highly committed with good ownership and accountability
• Able to adapt in a fast pace environment and work under pressure
• Proficient in MS Office Applications

This will be a 2-years direct contract position.

Responsibilities

• Lead End-to-End Delivery, taking full ownership of broad project scopes.
• Design and implement scalable operational workflows and tooling for large-scale infrastructure services.
• Build reusable automation and improve platform reliability.
• Identify and close gaps in observability, reducing technical debt, and creating meaningful visualisations and diagnostic tools.
• Create and implement standard operating procedures to ensure platform infrastructure services remain reliable, secure, and maintainable.
• Lead improvements to infrastructure design that enhance performance, availability, resiliency, and security.
• Lead architectural design reviews.
• Lead proof-of-concepts to validate new approaches.
• Lead large-scale infrastructure transformation efforts — including migrations from on-premise to cloud environments.
• Guide decisions on platform infrastructure systems.
• Evaluate emerging technologies.
• Oversee development of solutions from initial conceptualisation and design through to post-production monitoring
• Ensure high standards of quality, security, and compliance.
• Risk mitigation, troubleshooting of production issues, share lessons learned, and ensure root causes are addressed.
• Mentor and support junior platform infrastructure and infrastructure engineers — sharing knowledge, breaking down problems, and providing constructive feedback.
• Conduct regular check-ins with one or two direct or indirect reports, focusing on work progress and basic feedback delivery.
• Help team members navigate day-to-day blockers, provide technical mentoring, and participate in recruitment activities.
• Translate goals into actionable plans, breaking down and prioritising tasks while contributing to broader project strategy.
• Identify opportunities, drive workstreams, and synthesise data into clear recommendations that connect to organisational impact.
• Identify and mitigate risks, anticipating challenges before they materialise.
• Coordinate cross-functional collaboration, help resolve disagreements constructively, and facilitate alignment among team members and stakeholders.
• Challenge existing processes, drive continuous improvement, and lead change initiatives.

Requirements

• Degree in Computer Science, Information Systems, Computer Engineering, or equivalent hands-on experience in a related field.

Experience in

• CI/CD tools and pipelines using platforms such as GitLab CI/CD.
• Terraform or Ansible to automate infrastructure provisioning and management.
• Docker and Kubernetes for building, managing, and orchestrating containerized applications.
• Administering both Linux and Windows systems, including patching, performance tuning, and troubleshooting.
• Configuring and managing RabbitMQ or similar messaging systems.

Understanding of

• DevOps methodologies, Agile development practices, and cloud technologies (preferably Azure).
• Microsoft Azure and virtualization technologies like VMware.
• Networking concepts (e.g., TCP/IP, DNS, load balancing, firewalls, VPNs, subnets).
• Backend technologies such as Java, and scripting skills (e.g. Bash, Python) for automation.
• Analytical and troubleshooting skills across infrastructure, networks, and deployment pipelines.

Ethos Search Associates Pte. Ltd.

EA License No: 13C6655

EA Reg No: R1988580 Jacky Chong

About Micron 

Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-driven economy, where memory and storage are strategic differentiators. We are committed to sustainability, employee well-being, and community support, and we foster a culture of inclusion, collaboration, and continuous improvement. 

Job Summary 

Main Responsibilities: 
 As a Process Integration Module Engineer in the Process Integration department, you will be responsible for coordinating improvements in Yield, Quality, and Output for the NAND Flash production line. Day-to-day responsibilities include but not limit to crafting and analyzing process experiments, teaming with YE and PQA to investigate yield and quality problems and working with production and process engineering teams to ensure the smooth operation of the fab. 

Responsibilities and Tasks 

• Collaborate with multi-functional teams from PIE, Process & Equipment Engineering, WLR, TD to improve product yields and reliability within your assigned process loop. 

• Communicate module related issues to the Fab engineering and leadership teams. 

• Design, execute, and analyze experiments to improve fab process, yield, and quality. 

• Collect and interpret complex data to optimize Fab processes and increase yields. 

• Engage and/or lead cross-area engineering teams to tackle process issues. 

• Work closely with global partners to stay ahead of on module related topics and process alignment projects. 

• Collaborate with other PI module owners and sister fabs to drive business process alignment 

• Partner with IE, Process and Equipment Engineering and Production to better forecast and balance yield, output and process issues 

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Requirements:

• Bachelor’s or advanced degree in Engineering or Science is required

• Strong analytical, logical, and critical thinking skills 

• Effective communicator, able to collaborate across all levels 

• Growth mindset with a passion for continuous learning 

• Internship or experience in the semiconductor industry is a plus 

• Demonstrated leadership and a track record of impact are highly desirable 

• Interest in and knowledge of the semiconductor industry and Micron is preferred.

• Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.

• Embody Micron’s core values: 

• People – Respect, develop, and empower others 

• Innovation – Drive continuous improvement and breakthrough thinking 

• Tenacity – Show grit and determination 

• Collaboration – Build trust and foster teamwork 

• Customer Focus – Deliver excellence and value 

What to Expect  

Micron is proud to be an equal opportunity employer. All qualified applicants will receive consideration without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity, or any other protected factor. 

We are seeking a skilled and motivated Electrical Engineer to join our growing team. As an Electrical Engineer, you will play a crucial role in designing, developing, and maintaining electrical systems and components that power our Passenger Boarding Bridge. This position offers the opportunity of international industrial exposure and professional growth in electrical and electronic engineering knowledge.

Responsibilities:

• Assist in technical spec and design of application system to meet contractual requirements & functionality.
• Perform system setup & configuration, debug and troubleshooting programming related issues if arise.
• Handle integration of third-party equipment /system /software into in-house product if required.
• Continuous improvement on default system programming and innovations in new functionality.
• Coordinate and handle Factory Acceptance Test and Site Acceptance Test for related scope.
• Perform on-site and remote support if necessary.  
• Provide technical guidance to all stakeholder on preventive maintenance to ensue system are always at optimal level.
• Document and analyse root cause of system error for future enhancement.
• Develop cost estimates for electrical equipment and electrical works according to specification.
• Closely collaborate with Project Team to support the fulfilment of contract obligations within timeline, cost and scope.
• Perform other job responsibilities as and when assigned.

Requirements: ·

• Diploma/ Degree in relevant engineering field (Electrical / Electronic/ Automation/Computer Engineering etc.)
• Knowledge of AutoCAD 2D drafting is a MUST.
• Knowledge in planning and designing electrical panels and wiring systems.
• Knowledge in PLC programming and SCADA Development is a plus.
• Knowledge of standard Communication protocols like Modbus RTU/TCP, Profibus, RS422, RS485, NMEA, CANbus J1939.
• At least 2 years of relevant experience.
• Proactive, Meticulous & strong analytical skills.
• Willing to travel overseas.

Other Information: 

• Work location: Changi Airport
• 5 days work week
• Opportunities for overseas deployment 

Job Desctiption

• Coordinate steel structure works on site and ensure smooth execution.

• Liaise with consultants, main contractors, and site teams.

• Conduct site measurement and verify dimensions against drawings.

• Check and compare site conditions with drawings, highlight any discrepancies.

• Assist in shop drawing review and ensure works follow approved drawings.

• Support basic safety submissions (e.g. RA / MS) when required.

• Attend site meetings and resolve coordination issues.

• Monitor site progress, quality, and general site activities.

Requirements

• Diploma / Degree in Civil Engineering or related field.

• Minimum 2–5 years of site experience in construction (steel structure preferred).

• Able to read and understand construction drawings/shop-drawing/fabrication drawing

• Experience in site measurement is required.

• HDB project experience will be an advantage.

• Good coordination and communication skills.

• Able to work in site environment.

Job Description & Requirements

· Preparing inspection testing plan for all welding activities

·Conducting material inspection and material traceability

·Prepare, review of Welding Procedure Specifications (WPS) based on ASME and EN Standards ·Conduct a welding procedure and welder qualification tests

·Coordinate with client inspector for site & workshop inspection activities for piping, structural and equipment like heat exchangers pressure vessel, column

·Review the calibration status and keep a calibration log of test equipment

·Verify in process inspection, final inspection and welding

·Carry out Welding control and inspection . .

·Record result of inspections and maintain records of specific items as per client specifications ·Raise RFI request to Client and 3rd party and coordinate for inspection as identified ITP hold points

·Reviewing incoming material with Mill test certificates, Dimensional check and physical condition check

·Checking and verifying of receiving materials (pipes, flanges, fitting, Valves & Equipment, etc.,,) as per MTO, ensure that materials are correct according to the specification and description upon received

·Conduct inspection during all phases of fabrication, prior welding, during welding and after welding preparing Daily Welding Reports (DWR)

·Witnessing nondestructive testing (NDT) activities to follow up and confirm repairs, re-testing and re-inspection in accordance with specifications

·Witnessing post weld heat treatment (PWHT), Heating method & temperature record system ·Witnessing positive material identification (PMI), verify that all PMI of material has been performed as per specification

·Reviewing of RT, UT, MT, PT, PMI, PWHT & Hardness Test Reports

·Preparing welding surveillance report as per client requirement

·Prepare the of weld & NDT summary

·Completing/Endorsing all inspection records from initial inspection to final acceptance of weld joints

·Coordination with Client/its Representative /Third party inspector/ Suppliers for inspection requirements of the project

·Review hydro-test procedure and preparing hydro-test packages and spool release & Weld History documents

·Ensure that calibration certificate of test instruments such as pressure gauge, relief valve, manifold, pressure and temperature recorder prior to hydro test

·Ensure that the correct rating gaskets are installed

·Ensure that the A- punch list items Shall be closed before hydro test

·Witnessing & visual Inspection of pipeline internal cleaning /gauging

·Witnessing valve Hydro test in different ratings

·Witnessing valve installation, spool installation and bolt tightening

·Witnessing of pneumatic test, hydro-test, flushing

· Line check before commissioning activities and assist in Punch list preparation and punch list items closing

·Coordination with construction Team for Re-Instatement activities

·Preparing and maintaining QA/QC documents and final test packages for system lay-up.
. Coordinate with project managers, engineers, construction teams, and client representatives.

DUTIES AND RESPONSIBILITIES

• Provide on-site and/or remote technical assistance to customers, diagnosis and troubleshooting of technical problems
• Deployment, maintenance, upgrading and support of client computer systems (hardware, software, OS, network, etc.)
• Windows OS, AD, Office 365, Intune configuration and administration, patching & file server management
• Maintain a high level of user satisfaction with excellent customer service, offering solutions to meet clients’ needs
• IT asset management and other adhoc duties as assigned

QUALIFICATIONS

• Bachelor’s degree in computer science, IT or related field or equivalent in education and experience
• Knowledge in Microsoft O365, Teams, AD and management tools
• Knowledge in Logitech and Poly products video conference systems
• Knowledge in PC and IOS mobile devices
• Good coordination and communication skills with internal and external customers
• Strong analytical and issue resolution skills
• Strong collaborative and team coordination skills
• Able to work in a fast-paced environment
• Be well organized and able to work under pressure
• Good interpersonal skills with a service orientated approach
• Be able to work well individually as well as with a team

DUTIES AND RESPONSIBILITIES

• Provide on-site technical support in customers office, diagnosis and troubleshooting of technical problems
• Provide technical support to VIP users
• Deployment, maintenance, upgrading and support of client computer systems (hardware, software, OS, etc.) and video conference systems
• Windows OS, AD, Office 365 configuration and administration, patching & file server management
• Maintain a high level of user satisfaction with excellent customer service, offering solutions to meet clients’ needs
• IT asset management and other adhoc duties as assigned

QUALIFICATIONS

• Bachelor’s degree in computer science, IT or related field or equivalent in education and experience
• Knowledge in Cisco/Meraki/HPE routers, switch, access point
• Knowledge in Microsoft O365, Teams, AD and management tools
• Knowledge in APC, Apple, HP, Logitech, Poly products
• Good coordination and communication skills with internal and external customers
• Strong analytical and issue resolution skills
• Strong collaborative and team coordination skills
• Able to work in a fast-paced environment
• Be well organized and able to work under pressure
• Good interpersonal skills with a service orientated approach
• Be able to work well individually as well as with a team

Role and Responsibilities

•        Design, configure, and implement Jira ITSM forms

•        Develop and maintain custom workflows, business rules and groovy scripts

•        Implement ITIL-aligned processes for incident, problem, change, request and CMDB

•        Collaborate with stakeholders to translate functional requirements into effective technical designs

•        Develop and maintain Ansible playbook for infrastructure automation

•        Build REST API integrations with internal systems to enable seamless end-to-end automation

•        Support platform upgrades, patch management, and ensure optimal performance and availability

Requirements / Qualifications

•        Diploma/Degree in computer science or related IT discipline, or equivalent experience

•        ITIL v3/v4 certification or equivalent experience in IT service management

•        Openness to feedback and a commitment to continuous learning and skill development

•        Efficient knowledge of Windows Server and experience with Red Hat Enterprise Linux (RHEL) system administration

•        Familiarity with programming/scripting such as Python, PowerShell, or Bash

•        Understanding of Agile methodologies

•        Good written and verbal communication skills for effective user engagement

•        Good analytical and problem-solving skills to address technical challenges

•        Experience in cross-functional teams or projects is advantageous

•        Familiarity with AWS Cloud is a plus but not mandatory

• Prepare, schedule, coordinate and monitor the assigned projects
• Interact daily with manager to interpret their needs and requirements
• Perform overall quality control of the work (budget, schedule, plans, personnel’s performance) and report regularly on project status
• Preparation of shop drawing using AUTOCAD
• Preparation of drawing estimation and submission of quotation to client.
• Cooperate and communicate effectively with project/operation manager and other project participants to provide assistance and technical support
• Design and detailed drafting accordingly to requirements by using AUTOCAD
• Do other Adhoc duties assigned by manager.

A Piling sub-contractor company specialized in Bore-Piling and Soil Foundation Engineering works looking for suitable candidates for the above positions :

Requirements

• A degree holder in Civil Engineering
• Minimum 3 years working experience in bore-piling operation
• Able to work in robust environment
• Can work with multi-national workforces
• Own a personal transport is an advantages.

M&E Coordinator/Engineer

Job Responsibilities:

Assist Project Manager in supervising and coordinating all services and complete within programme

Manage M&E subcontractors to execute mechanical and electrical works in construction

Supervise M&E subcontractor day to day site works

Conduct in detailed, M&E coordination with all specialist contractors

Carry out testing and commission of M&E work

Ensure contractor comply with all necessary standards, code of practice and safety regulations

Any other adhoc duties as assigned

Job Requirements:

Diploma / Degree in Mechanical & Electrical Engineering or equivalent

3-5 years of relevant experience in supervision of M&E works installation

Able to work independently

As a Bonding Process & Equipment Engineer at Micron Technology, you will be part of Micron Central team under ADT, responsible for the startup, development, optimization, and control of wafer leve bonding processes (e.g., hybrid bonding, fusion bonding, temporary bonding).

You will drive yield improvement, cost reduction, process capability enhancement, and risk management, while resolving complex manufacturing challenges. This role requires collaboration across process integration, equipment engineering, suppliers, and global manufacturing sites.

Key Responsibilities

Process Development & Optimization

• Develop, qualify, and optimize bonding process technologies (e.g., hybrid bonding, dielectric bonding, TSV-related integration)

• Establish, refine and simplify process conditions, recipes, and operating windows to meet performance and reliability targets

• Drive process capability improvement (Cpk) and defect reduction

Yield & Reliability Improvement

• Lead yield enhancement initiatives by analyzing process, tool, and material interactions

• Perform systematic root cause analysis using methodologies such as DOE, FMEA, 8D, SPC, and fault isolation techniques

• Evaluate defect modes (voids, misalignment, delamination, corrosion) and implement corrective actions

Equipment & Materials Engineering

• Collaborate with equipment engineering to qualify and optimize bonding grinding and trimming tools (e.g., EVG, TEL, Disco platforms)

• Define equipment specifications, roadmap, process control strategies, and matching/fingerprinting requirements

• Evaluate and introduce new materials/spares/parts for performance improvement

Technology Transfer & Process Integration

• Support technology transfer and ramp-up across global sites

• Align process baseline (POR) and ensure consistency through documentation and control plans

• Work closely with integration, CMP, WET, and Films teams to ensure cross-module compatibility

Manufacturing Support & Problem Solving

• Diagnose and resolve manufacturing line issues impacting bonding yield and performance

• Analyze process excursions and implement containment and recovery actions

• Drive continuous improvement for cycle time, tool availability, and cost efficiency

Qualification & Control

• Lead new process and baseline qualifications

• Develop control plans, SPC strategies, and inline monitoring systems

• Establish risk mitigation frameworks and ensure compliance with manufacturing standards

Supplier & Cross-Functional Collaboration

• Partner with suppliers for technology development, process improvement, and cost optimization

• Audit material and equipment suppliers to ensure quality and reliability targets are met

• Collaborate with global teams and partners to drive alignment and execution

Qualifications

Technical Expertise

• Strong knowledge of semiconductor bonding processes (wafer to wafer hybrid bonding, fusion bonding preferred)

• Understanding of Cu plating, CMP interaction, surface preparation, and defect mechanisms

• Experience with advanced packaging technologies (HBM, TSV, wafer-to-wafer bonding) is highly preferred

Skills & Competencies

• Proficiency in data analysis, SPC, and statistical modeling

• Strong problem-solving skills using structured methodologies (8D, FMEA, DOE)

• Ability to manage complex projects involving multiple functions in a high-volume manufacturing environment

• Excellent communication and collaboration skills across global teams

Education & Experience

• Bachelor’s, Master’s, or Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, or related field

• 7 years+ Relevant proven experience in semiconductor manufacturing or advanced packaging

As a Bonding Process & Equipment Engineer at Micron Technology, you will be part of Micron Central team under ADT, responsible for the startup, development, optimization, and control of wafer leve bonding processes (e.g., hybrid bonding, fusion bonding, temporary bonding).

You will drive yield improvement, cost reduction, process capability enhancement, and risk management, while resolving complex manufacturing challenges. This role requires collaboration across process integration, equipment engineering, suppliers, and global manufacturing sites.

Key Responsibilities

Process Development & Optimization

• Develop, qualify, and optimize bonding process technologies (e.g., hybrid bonding, dielectric bonding, TSV-related integration)

• Establish, refine and simplify process conditions, recipes, and operating windows to meet performance and reliability targets

• Drive process capability improvement (Cpk) and defect reduction

Yield & Reliability Improvement

• Lead yield enhancement initiatives by analyzing process, tool, and material interactions

• Perform systematic root cause analysis using methodologies such as DOE, FMEA, 8D, SPC, and fault isolation techniques

• Evaluate defect modes (voids, misalignment, delamination, corrosion) and implement corrective actions

Equipment & Materials Engineering

• Collaborate with equipment engineering to qualify and optimize bonding grinding and trimming tools (e.g., EVG, TEL, Disco platforms)

• Define equipment specifications, roadmap, process control strategies, and matching/fingerprinting requirements

• Evaluate and introduce new materials/spares/parts for performance improvement

Technology Transfer & Process Integration

• Support technology transfer and ramp-up across global sites

• Align process baseline (POR) and ensure consistency through documentation and control plans

• Work closely with integration, CMP, WET, and Films teams to ensure cross-module compatibility

Manufacturing Support & Problem Solving

• Diagnose and resolve manufacturing line issues impacting bonding yield and performance

• Analyze process excursions and implement containment and recovery actions

• Drive continuous improvement for cycle time, tool availability, and cost efficiency

Qualification & Control

• Lead new process and baseline qualifications

• Develop control plans, SPC strategies, and inline monitoring systems

• Establish risk mitigation frameworks and ensure compliance with manufacturing standards

Supplier & Cross-Functional Collaboration

• Partner with suppliers for technology development, process improvement, and cost optimization

• Audit material and equipment suppliers to ensure quality and reliability targets are met

• Collaborate with global teams and partners to drive alignment and execution

Qualifications

Technical Expertise

• Strong knowledge of semiconductor bonding processes (wafer to wafer hybrid bonding, fusion bonding preferred)

• Understanding of Cu plating, CMP interaction, surface preparation, and defect mechanisms

• Experience with advanced packaging technologies (HBM, TSV, wafer-to-wafer bonding) is highly preferred

Skills & Competencies

• Proficiency in data analysis, SPC, and statistical modeling

• Strong problem-solving skills using structured methodologies (8D, FMEA, DOE)

• Ability to manage complex projects involving multiple functions in a high-volume manufacturing environment

• Excellent communication and collaboration skills across global teams

Education & Experience

• Bachelor’s, Master’s, or Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, or related field

• 7 years+ Relevant proven experience in semiconductor manufacturing or advanced packaging

Responsibilities:

• Assist to organize construction drawings and other construction documents including material approval, drawing approval, method statement and calculation approval, approval letters and drawings of government departments
• Attend of technical / BS / progress meetings and prepare meeting minutes
• Assist to coordinate and prepare short term programme
• Assist in the monitoring of finishing work schedule
• Assist the drafting and submission of material requisition form
• Assist the monitoring the wastage of finishing and construction materials
• Assist in the drafting of notice of rectification and site memorandum to subcontractors
• Collect information from operation team to complete daily report, and organize project photo records
• Work with the Compliance Department to conduct inspection on quality and self-test with reference to site Q.A. and safety plan
• Provide assistance to maintain and update the quality records of the finishing works.
• Properly prepare for the internal and external audits to avoid or minimize non-compliance
• Assist to conduct inspection with resident consultants and subcontractors.
• Arrange testing for finishing materials and submit the relevant reports
• Enhance communication in defect liability period & maintain adequate service

Requirement:

• A completed apprenticeship or similar experience is recommended.
• Strong analytical, troubleshooting, problem-solving, and communication skills.
• Ability to follow instructions and to collaborate with others.
• Ability to work independently with minimal supervision
• Knowledge of building codes and standards