Total 66 Senior Executive process improvement manager job vacancies in Engineering category in Hong Kong

Requirement

1. Minimum 2 years of experience in construction industry
2. Strong technical knowledge and understanding of engineering principles, project management methodologies, and construction processes
3. Excellent problem-solving, decision-making, and communication skills
4. Demonstrated ability to work collaboratively in a team environment and lead cross-functional projects
5. Minimum diploma in Civil Engineering or a related field

Responsibilities

1. Manage all aspects of assigned projects, including planning, coordination, budgeting, and resource allocation
2. Liaise with clients, contractors, and stakeholders to ensure effective communication and prompt issue resolution
3. Monitor project progress, identify and mitigate risks, and implement corrective actions as needed
4. Oversee the work of site teams, including supervising contractors and ensuring compliance with safety and quality standards
5. Providing technical expertise and guidance to the project team
6. Identify opportunities for process improvements and contribute to the overall growth and success of the company

Perks & Benefits

• Allowance (travel stipends etc.)
• Medical coverage
• Maternity leave
• Parental leave
• Yearly Performance Bonus

要求

1. 至少兩年建築業經驗
2. 具備紮實的技術知識和對工程原理、專案管理方法和施工流程的深刻理解。
3. 優秀的解決問題、決策與溝通能力
4. 具備在團隊環境中協作工作和領導跨職能專案的能力
5. 土木工程或相關領域最低文憑

職責

1. 負責管理分配專案的各個方面，包括規劃、協調、預算和資源分配。
2. 與客戶、承包商和利害關係人聯絡，以確保有效溝通和及時解決問題。
3. 監控專案進度，識別並降低風險，並根據需要採取糾正措施。
4. 監督現場團隊的工作，包括監管承包商並確保遵守安全和品質標準。
5. 為專案團隊提供技術專長和指導
6. 發現流程改善機會，並為公司的整體發展和成功做出貢獻。

福利待遇

• 津貼（差旅補助等）
• 醫療保險
• 產假
• 育嬰假
• 年度績效獎金

Roles and Responsibilities:

•  Ensure timely submission of process deliverables, including PFDs, P&IDs, hydraulic profiles, equipment sizing, HAZOP study reports, etc

•  Lead in the P&ID (Piping and Instrumentation Diagrams) drawings submissions utilizing Bentley OPPID, PFD (Process Flow Diagrams), and mass balance calculations

•  Lead in RO Membrane design selection and process.

·   Participate and coordinate in HAZOP (Hazard and Operability) studies for the overall plant and its systems/sub-systems.

•  Integrate equipment and material capabilities to meet process module and technology specifications.

•  Taking the lead in discussion with clients on planning and execution of the testing and commissioning for successful project completion.

•   Analyze and review current processes to streamline them for improvement, productivity enhancement, sequence optimization, unit improvement, and troubleshooting of the plant during testing and commissioning.

•   Attend technical meetings with clients, vendors, sub-contractors, and internal project teams.

•  Collaborate with various disciplines engineers to ensure all interfacing issues are aligned and resolved to mitigate engineering rework.

·   Any other ad-hoc engineering duties to support the Project Manager for successful execution of the project.

This position will have responsibility for providing process support and installation of new plasma etch / clean / deposition systems at customer sites. This includes design, evaluation and documentation of process window for new installations or Lam recommended field hardware modifications / upgrades.

1. Work closely with Account team and customers to understand customer technology roadmaps, process flow, inflection points, requirements and business issues / challenges. Identify areas where Lam is able to value-add.
2. Work with Account team and customers to execute to penetration and defense strategy, including coordinating with Global Product Group on product demonstration
3. Perform startup of “capacity add” Lam systems i.e. match results to existing systems and applications
4. Design and complete simple DOE evaluations to characterize process window for new installations or Lam recommended field hardware modifications / upgrades
5. Conduct experiments and tests, collect and analyze data and generate reports for both internal and external distribution
6. Develop new processes to new and/or existing customer applications
7. Professionally represent the company to the customer. Utilize knowledge of company’s product lines and service to keep existing / potential customers informed when new/additional needs are identified
8. Develop good customer relations during start-up and trouble-shooting
9. Maintain company’s assigned equipment (computer, tool kit, diagnostic test equipment, spare parts etc) in good working condition, secure and accounted for
10. Ensure safe working condition at work site
11. Any other duties as assigned by the Immediate Supervisor

Job Requirements:

1. Engineering degree or Bachelor of Science (in Chemistry / Physics) or equivalent
2. Systematic and has an analytical mind
3. Good communication and interpersonal relations skill
4. Able to actively engage customers on technical solutions
5. Able to work in Fab environment and perform standby duties

Responsibilities

• Lead the development of mass balances, hydraulic profiles (P&IDs) and process flow diagrams for water treatment plants.

• Conducting process modelling, simulations and pilot testing to validate new technologies and process improvements

• Size and specify process equipment, such as pumps, blowers, tanks and etc. to meet system performance and reliability requirements

• Evaluate supplier proposals, quotations to ensure compliance with technical and commercial requirements

• Collaborate with cross-functional teams to plan and execute projects

• Provide onsite technical support during project execution and lead troubleshooting of operational issues

• Lead plant testing and commissioning.

• Prepare commissioning plans, SOPs, O&M manuals and training materials.

• Support proposal development and tender preparation.

• Mentor junior engineers and designers.

• Execute other ad-hoc tasks as assigned to support project and team objectives

Requirement

• Degree in Chemical Engineering, Environmental, Civil Engineering or a related technical discipline

• 8+ years' experience as a Process Engineer or Senior Process Engineer, preferably in the water treatment industry

• Proficient in AutoCAD

• Strong problem-solving, analytical and critical thinking skills

• Excellent interpersonal and communication skills

We are seeking a highly skilled Senior Process Integration Engineer to lead the development and optimization of Indium Phosphide (InP) based Edge Emitting Lasers (EELs). In this role, you will be the bridge between design and manufacturing, ensuring that our high-performance optoelectronic devices transition from concept to high-volume production with world-class reliability and yield.

You’ll be working at the frontier of photonics, handling complex material systems and sophisticated fabrication sequences to power the next generation of optical communications and sensing technologies.

Core Responsibilities

• Process Flow Ownership: Design, implement, and manage the full end-to-end fabrication flow for InP-based EELs (e.g., Fabry-Pérot, DFB, and DBR lasers).
• Yield & Performance Optimization: Identify and resolve integration bottlenecks. Use Statistical Process Control (SPC) and Design of Experiments (DOE) to improve device electro-optical performance (threshold current, wall-plug efficiency, and slope efficiency).
• Cross-Functional Collaboration: Partner with Epitaxy (MOCVD) teams to optimize regrowth interfaces and with the Design team to ensure Layout-to-Mask integrity.
• Advanced Fabrication Management: Oversee critical steps including dry/wet etching (ICP/RIE), dielectric deposition (PECVD/ALD), metallization etc.
• Failure Analysis: Coordinate Root Cause Analysis (RCA) on fabrication failures using SEM, TEM, and FIB diagnostics to drive continuous improvement.

Key Technical Requirements

• Materials Expertise: Deep understanding of III-V compound semiconductors, specifically the GaAs/InP/InGaAsP/material systems.
• Device Physics: Strong grasp of semiconductor laser physics
• Fabrication Proficiency: Hands-on experience or good understanding on photolithography, etching, thin film
• Characterization:  Understanding laser characterization data and correlating results back to specific process modules.

Qualifications

• Education: PhD or Master’s degree in Electrical Engineering, Physics, Materials Science, or a related field.
• Experience: 5+ years of direct experience in III-V semiconductor processing
• Software: Proficiency in JMP, or Python for data analysis;
• Mindset: A methodical troubleshooter who thrives in a cleanroom environment and enjoys the "detective work" of process integration.

About STMicroelectronics

At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products,solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027.

Further information can be found at www.st.com

YOUR ROLE 

1. Set-up process recipe of newly setup process equipment.
2. Perform qualification for new process equipment and new process recipe.
3. Evaluate the new processes and make a series of process characterization.
4. Perform inline troubleshooting and qualification in daily operation.
5. Follow Gemba activity to identify opportunity of improvement in operation and quality aspects.

YOUR SKILLS & EXPERIENCES

• Degree in engineering of materials, chemistry
• Knowledge of excel, office suite.
• English language proficiency
• at least 5 years experience in wafer fab process engineering, and having at least 3 years experience in DCVD process; preferred experienced in DCVD process tool type in Applied materials Centura and Producer.
• Strong CVD process technical knowledge background, with experience to develop and optimize new process recipe
• Master SPC, FMEA and 8D problem solving methodology.

Job Description:

• Analyse SPC chart. Know all the PR rules and their significance. Do proper annotation to maintain quality troubleshooting rate for SPC OOC. Understand Cp and Cpk indices.
• Monitor critical SPC charts daily. Perform process window study and provide improvement plan to reduce OOC and improve CPK
• Analyse split lot, DOE data, ET, sort yield using JMP, Klarity ACE.
• Create SPC charts, DCOP and modify SLDB using PROMIS (Si-View).
• Upload recipe, check recipe and ensure recipe content compliance using RMS.
• Follow up on SPSR, MRB, 8D, TECN, or spec update with ECN.
• Setup and troubleshoot in recipes/ job files in all metrology tools within the Module.
• Follow up on pass down to troubleshoot process issues. Establish CAS / procedures to be followed and work with other departments for resolution if required.
• Startup and qualify new process and new equipment within scheduled timeline. Work closely with the Equipment Engineer on new equipment acceptance. Know the concept of repeatability and reproducibility (R&R) run.
• Work on reducing process constraint so that Manufacturing can have more flexibility.
• Perform process matching between equipment to reduce variation and analysis / DOE to find factors for better tool matching.
• Participate in CIP programs to optimize process window, cost, yield, and productivity.
• Work as a team with both Equipment and Manufacturing Engineers to meet Module objectives. Work to meet the key indices of Uptime and OEE goals.
• Represent own Module to attend cross-functional task team to address yield improvement/ excursion issues. Follow up with cross-fab benchmarking activities to engage the best-in-campus practices across fabs.
• Self-audit and update specifications/ documentation to meet TS16949 Quality Standard requirements.
• Follow good housekeeping and safety rules in office and FAB.
• Provide feedback/ training to AEs or Techs on their troubleshooting skills, understanding of processes, decision making, risk assessment.

Requirements:

• Degree in Electrical / Electronics /Microelectronics / Chemical Process Engineering / Chemistry / Physics related major
• Min 2 years working experience in Diffusion (implant, Furnace and WET/Clean Tech) Process.
• Good interpersonal skills and is an excellent team player
• Logical thinking capability and good analytical skill
• Highly level of integrity with good ownership and accountability
• Passion for the semiconductor / manufacturing industry

As a Senior/Staff LithographyProcess Engineer, you will lead the development and optimization of lithographyprocesses for both Fan-In and Fan-Out eWLB (Embedded Wafer Level Ball GridArray) packaging technologies. You will be responsible for driving keyengineering projects such as yield improvement, cost reduction, and processtransfers across global manufacturing sites.

Key Responsibilities:

• Own and optimize lithography processes for PI, PR, and other patterning layers in both FO and FI eWLB.
• Manage photolithography tools (GHI/i-line stepper, coat/develop tracks, etc.), including recipe setup and troubleshooting.
• Lead cross-functional projects focused on cost reduction, process robustness, and NPI transfer.
• Lead process improvements to enhance yield, throughput, and cost efficiency.
• Evaluate and implement new lithography materials (PSPI, PR) and tools.
• Define and maintain process documentation (SOP, OCAP, FMEA, SPC) and training programs.
• Collaborate with equipment vendors, materials suppliers, and internal engineering teams to evaluate and qualify new tools or materials.
• Design and perform DOE, root cause analysis, and statistical data analysis (e.g., JMP, Camline, etc.).
• Support daily fab operations with issue resolution and yield improvement initiatives.
• Mentor junior engineers and provide technical direction to the litho team.
•  

Qualifications:

• Bachelor’s or Master’s degree in Engineering (Materials, Chemical, EE, or related field).
• 5+ years hands-on experience in photolithography process, preferably in advanced packaging (eWLB, WLP, FO-PLP).
• Strong knowledge of lithography tooling, including exposure systems and coater/developer tracks.
• Skilled in project management, process transfer, and cost/yield improvement.
• Familiar with SPC, FMEA, and problem-solving methodologies.
• Excellent communication skills, with proven ability to engage with both internal stakeholders and external customers.
• Fluent in both English and Chinese. (This role will need to liaise with customers and counterpart from China)

Responsibilities

• Day to Day monitoring and ownership to timely address in-line SPC/defect/Equipment abnormality, handling and disposition

• Manage projects in productivity improvement, particularly for new processes, using process characteristic analytical tool to improve process condition and technology

• Establish process parameters for a variety of semiconductor equipment to ensure line stability

• Evaluation and development of new equipment/materials/process

Qualifications

• Minimum requirement of a Bachelor's Degree in Electronic Engineering , Electrical Electronic Engineering, Chemical Engineering, Materials Science, Mechanical Engineering and Physics

• Demonstrated experience of at least 5-7 years in semiconductor foundry dry etch module process

• 22/28 nanometer and below advance technology nodes experience is highly desirable

• Strong understanding of process development, optimization and troubleshooting.

• Proven leadership skills in leading cross-functional teams and managing projects related to process improvement or technology transfer

• Ability to analyze complex process issues, identify root causes, and implement effective solutions

• Experience skills including SPC, 8D reporting, DOE, FMEA and PMO is preferred

• Able to commit shift work

Introduction:

Process integration in development, optimization, and qualification of semiconductor devices/processes to meet performance requirements.

Your Job:

• Process integration in development, optimization, and qualification of semiconductor devices/processes to meet performance requirements.

• DOE design, execution, and analysis of results.

• Partner process module engineers to improve device/yield performance.

• Own and drive technical process problem solving.

• Interact with internal & external customers and respond to technical queries.

• Establish new technology design rules, test structures and test methodologies.

• Innovate new methods of continuous process/device improvement.

Other Responsibilities:

Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs

Required Qualifications

• Education - Degree/master's in electrical, Electronics Engineering or equivalent.

• 4 year’s relevant experience for Degree.

  Wafer Fab process integration experience is required.

Preferred Qualifications:

• Knowledge of semiconductor device physics and/or RF fundamentals (e.g. S-parameters) is a plus.

• Independent, resourceful, with a positive attitude toward continuous learning & knowledge acquisition.

• Excellent analytical and optimization skills.

• Great interpersonal skills and ability to work with cross-functional teams.

GlobalFoundries is an equal opportunity employer, cultivating a diverse and inclusive workforce. We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard.

As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.

All offers of employment with GlobalFoundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.

The Process engineer plays a vital role in D2W hybrid bonding process optimization, yield improvement and to develop innovating process flow or path finding. PE Works closely between internal Hybrid team, partner and Customers.

• Responsible for process development & CIP’s to improve the product yield
• To conduct DOE’s and experimental process trails and data analysis
• Define new process flow for customer products and run internal feasibilities
• Provides technical subject matter expertise in the area process developments
• Understands the Hybrid bonding upstream & downstream process flow to relate actual Hybrid bonding or Fusion bonding yield related topics
• Process optimization and data analysis to improve the process responses hybrid bonding and annealing
• Supports SOP, technical documentation and product operating manual writing activities and publish BKM process flow
• Builds-up technical know-how on product/problem solving via structured knowledge transfer between the on-site support team
• Machine and Technical Support
• Machine operation and application/product setup
• Prepares and executes customer demo feasibilities and recommend the process flow
• Coordinates and provides technical solutions / problems solving on customer process related issues in collaboration with Field issues
• Investigates process issues at customer site and supports Engineering team

Education

• Master’s in mechanical/electrical/Electronics /Physics or PHD

Work experience

• Minimum 5 years relevant experience in C2W or W2W hybrid bonding and Front end wafer fab/backend process
• Significant practical experience in solving process issues and process optimizations including new process setup
• Hands-on experience in semiconductor front end or backend Process and equipment’s including defectivity & yield engineering

Expertise and methodology

• Good in MS-Office, data analysis SW like JMP, Matlab
• Hands-on Process Development Expertise and able to share the Problem Statement in crystal clear

EA License : 02C3423

EA Personnel : R22108699

Job's mission

As a Senior Process Engineer in Advanced Packaging, you will bring your PhD research experience into an industrial R&D environment, contributing to the development of semiconductor process technologies used in next-generation devices. Working closely with experienced engineers and scientists, you will translate scientific insight into scalable, manufacturable solutions. Your work will directly support ASM’s mission to enable the chips that power today’s most advanced technologies.

What you will be working on

• Contribute to the research, development, and optimization of semiconductor processes for Advanced Packaging, including thin-film deposition (ALD, PECVD, PVD, ECP) and surface preparation technologies.
• Design, execute, and analyze experiments using DOE-based approaches, supported by senior technical experts.
• Perform materials and process characterization to evaluate film quality, reliability, and performance.
• Analyze experimental data and clearly document results in technical reports and internal presentations.
• Collaborate with cross-functional teams across R&D, process engineering, and applications.
• Support troubleshooting of process or equipment issues in laboratory and pilot environments.
• Participate in technology reviews and contribute ideas to process improvement and innovation initiatives.
• Learn industry best practices for transitioning processes from development into customer and manufacturing environments.

What we are looking for

• PhD in Chemical Engineering, Materials Science, Physics, Mechanical Engineering, Electrical Engineering,
• Hands-on research experience with thin-film deposition processes such as ALD, CVD, PECVD, or PVD.
• Strong experimental background, including designing experiments and analyzing complex data sets.
• Solid problem-solving and analytical skills, with a structured approach to research challenges.
• Clear written and verbal communication skills, with the ability to explain technical concepts to diverse audiences.
• Curiosity, initiative, and motivation to apply academic research in an industrial setting.
• Strong understanding of electro/mechanical equipment and software systems

What sets you apart

• Research experience related to advanced packaging, interconnects, or semiconductor manufacturing
• Familiarity with statistical methods, DOE tools, or data modeling techniques.
• Experience with materials characterization methods such as SEM, TEM, XRD, or ellipsometry.
• Exposure to cross-disciplinary or collaborative research environments.
• Interest in long-term growth within semiconductor technology development and process engineering.

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

JOB SCOPE & JOB RESPONSIBILITIES

• Familiar with RO, demin, mixed bed, ultra-pure, neutralization, chemical preciptation (including HF, heavy metal, backgrind etc.), biological treatment etc. and specialty processes.
• Develop process design packages: heat & mass balances; PFDs; P&IDs; process calculations.
• Perform equipment sizing and prepare specification (pumps, blowers, air compressors, vessels, tanks) and materials selection; define instrumentation and control philosophy with cause-and-effect matrices.
• Liaise with OEMs/vendors to validate technologies and recommend best-fit solutions based on performance, compliance, schedule, and total cost of ownership (CAPEX+OPEX); drive technical clarifications and value engineering.
• Prepare and review equipment lists, line lists, valve list and load lists as required.
• Prepare and check process datasheets for RFQs; evaluate vendor proposals for compliance with technical specs, codes, and regulations; lead technical clarifications.
• Prepare technical proposal according to client's RFQs. Provide solution to clarifications and prepare cost estimation.
• Plan and participate in HAZOP and related reviews, coordinate action close-out.
• Produce/peer-review submission documentation; support project FAT/SAT, plant start-up, performance testing, process optimization, and handover.
• Compile/author ITP/IP and IOM manuals; interface with multidisciplinary teams (C&S, MEICA, controls) and construction/site teams.

JOB REQUIREMENTS

• Degree in Chemical or Environmental Engineering (or equivalent)
• Standards & codes: Familiar with relevant international standards/codes and onshore/offshore practices
• Proficiency with MS Office
• Working knowledge of AFT Fathom (hydraulic analysis) and AutoCAD Plant 3D (P&ID) is an advantage

WORK EXPERIENCES

• Process Engineer: More than 2 years in a similar scope, preferably in Oil & Gas, Power, or Water/Wastewater
• Senior Process Engineer: More than 5 years with demonstrated leadership in design reviews, HAZOP facilitation/close-out, vendor management and mentoring junior engineers.

Key Responsibilities:

• Lead the architecture design (e.g. memory cells, select transistors, and peripheral devices), process integration, electrical characterization, modeling and simulation, failure analysis for 3D NAND devices.
• Design and execute DoE, analyze the impact of process variations on device performance and reliability (such as durability and data retention), and propose improvement solutions.
• Collaborate with the process development team to assess new device architectures, driving technology iteration.
• Write detailed technical reports and support customers or internal teams in resolving related technical issues.

Required Qualifications:

1. Education: Master's degree or above
2. Major: Microelectronics, physics, material science & engineering, chemistry;
3. Other Requirements:

• 8+ years of semiconductor device work experience, 3+ years of 3D NAND work experience.
• In-depth knowledge of 3D NAND device physics, familiar with its principles, failure modes, and reliability mechanisms.
• Troubleshooting, and problem-solving capabilities, with experience in successfully improving device performance or yield.
• Familiar with advanced semiconductor manufacturing processes and integration flows.
• Strong cross-team communication and collaboration skills.