Total 185 software engineer job vacancies in Education / Training category in Australia

We are looking for a motivated Research & Technical Support Engineer/Scientist to develop, maintain, and support BEOL furnace processes including BEOL metal anneal, barrier/liner engineering, dielectric curing, hydrogen anneals, and stress‑relief treatments. This role involves both fundamental materials science and hands‑on tool/process ownership in a cleanroom research environment. You will collaborate with R&D teams working on advanced interconnect technologies, photonic integration, 3D integration, and novel dielectric/metallization schemes.

Job Responsibilities:

BEOL Furnace Process Development

• Develop and optimize BEOL thermal processes including Metal anneal, Barrier/liner stabilization, Dielectric curing, Passivation and Stress‑relief anneals
• Perform tool qualification, recipe loading, chamber matching, SPC set up and contamination monitoring.
• Troubleshoot process excursions and ensure stable operations with high repeatability.
• Correlates anneal conditions with film quality, stress, adhesion, and reliability metrics.

Cross‑Functional Collaboration

• Work closely with teams in Photonic IC, Wide-Bandgap Devices, Packaging and reliability for process integration.
• Provide guidance for internal projects on thermal budgets, thermal‑stress implications, and BEOL process compatibility for novel materials and device architectures.

Job Requirements:

• Degree (Bachelor, or Master based on job scope) or above in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Chemistry, Physics or related fields.
• 3 years of working experience in Semiconductor Fabrication is advantageous.
• Hands‑on experience with furnace processing, anneals, or BEOL‑related thermal steps is highly wanted.
• Knowledge of metallization physics, anneal passivation, interconnect reliability and dielectric curing.
• Understanding of thermal budget constraints and stress‑management in BEOL stacks.
• Hands-on experience in Design of Experiments (DOE), root cause analysis, and problem-solving methods is desired.
• Experience in Photonic IC, SiC devices, 2.5D/3D packaging and/or Wafer Bonding would be a plus.
• Proficiency with materials characterization tools, such as ellipsometry, XRD, XPS, TEM, SEM, stress measurement

We are looking for a motivated Research & Technical Support Engineer/Scientist to develop, maintain, and support BEOL furnace processes including BEOL metal anneal, barrier/liner engineering, dielectric curing, hydrogen anneals, and stress‑relief treatments. This role involves both fundamental materials science and hands‑on tool/process ownership in a cleanroom research environment. You will collaborate with R&D teams working on advanced interconnect technologies, photonic integration, 3D integration, and novel dielectric/metallization schemes.

Job Responsibilities:

BEOL Furnace Process Development

• Develop and optimize BEOL thermal processes including Metal anneal, Barrier/liner stabilization, Dielectric curing, Passivation and Stress‑relief anneals
• Perform tool qualification, recipe loading, chamber matching, SPC set up and contamination monitoring.
• Troubleshoot process excursions and ensure stable operations with high repeatability.
• Correlates anneal conditions with film quality, stress, adhesion, and reliability metrics.

Cross‑Functional Collaboration

• Work closely with teams in Photonic IC, Wide-Bandgap Devices, Packaging and reliability for process integration.
• Provide guidance for internal projects on thermal budgets, thermal‑stress implications, and BEOL process compatibility for novel materials and device architectures.

Job Requirements:

• Degree (Bachelor, or Master based on job scope) or above in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Chemistry, Physics or related fields.
• 3 years of working experience in Semiconductor Fabrication is advantageous.
• Hands‑on experience with furnace processing, anneals, or BEOL‑related thermal steps is highly wanted.
• Knowledge of metallization physics, anneal passivation, interconnect reliability and dielectric curing.
• Understanding of thermal budget constraints and stress‑management in BEOL stacks.
• Hands-on experience in Design of Experiments (DOE), root cause analysis, and problem-solving methods is desired.
• Experience in Photonic IC, SiC devices, 2.5D/3D packaging and/or Wafer Bonding would be a plus.
• Proficiency with materials characterization tools, such as ellipsometry, XRD, XPS, TEM, SEM, stress measurement

As Singapore’s University for Industry, SIT works closely with industry partners in our research pursuits. Our research staff will have the opportunity to be equipped with applied research skill sets that are relevant to industry demands while working on research projects in SIT. The primary responsibility of this position is to deliver on a research project to develop an End-to-end misinformation and disinformation protection, awareness and mitigation pipeline. We will be recruiting a research engineers or fellows, as part of a wider project, to conduct research on: Signal processing combined with AI-based modification on speech signals. The need is for a real-time system, so efficient coding is important.

Key Responsibilities:
• Participate in and manage the research project with Principal Investigator (PI) Ian McLoughlin, Co-PI Tong Rong and the research team members to ensure all project deliverables are met. 
• Undertake research within your domain, including keeping track of state-of-the-art work. Develop the code, evaluate and test. Write academic publications.
• Deliver solution-ready demonstration code.
• Interact well within the team and the customers.
• Be self-directed to fulfil the project requirements.

Job Requirements:
• Competence in working with languages such as C along with AI applications as well as Python-based coding .
• Have a degree in Computer Science/Computer Engineering. Possessing a Master’s or PhD degree will definitely be advantageous.
• Knowledge of machine learning, pytorch, huggingface etc...
• Knowledge of speech, audio, time-series or signal processing is required.
• Ability to effectively and efficiently utilise industry-standard Linux-based computers for AI.
• Experience of authoring good quality academic publications.
• Manage undergraduate research assistants (if appropriate).
• Liaise with customers and collaborators in A*STAR and NTU, as well as collaborators in the UK and China.

Key Competencies:
• A self-directed worker who believes in continuous learning and development
• Proficient in academic writing 
• Possess good critical thinking skills
• Show strong initiative and take ownership of work
• Interest in AI, machine learning, image/audio processing

Interested applicants are invited to apply directly at the NUS Career Portal

Your application will be processed only if you apply via NUS Career Portal

We regret that only shortlisted candidates will be notified.

Job Description

The Research Assistant/Engineer will be involved in field sampling of coastal and fresh waters as well as laboratory analysis of water quality. The data will be used to develop computer models for predicting microbial and chemical water quality. In addition to the above, the Research Assistant/ Engineer is expected to contribute actively in writing reports and research papers, presenting research updates and liasing with external parties.

Qualifications

• A Bachelor in Environmental Engineering or equivalent. 
• Experience in water quality/environmental modelling and/or experience in water quality analysis and environmental engineering is preferred.  

Responsibilities:

• Develop and optimize processes for SiC Device module integration, flows for SiC devices fabrication, focusing on process integration and yield improvement.
• Collaborate with cross-functional teams to design and implement process modules for SiC devices manufacturing.
• Conduct experiments, analyze data and refine processes to achieve targeted performance and yield.
• Troubleshoot and resolve issues related to device integration and process development.
• Document procedures, maintain details record, and standard operating procedures (SOP)

Job Requirement:

• Diploma, Bachelor’s or Master’s in Electronics Engineering, Materials Science, Physics, or related field.
• Proven experience (1-2 years) in semiconductor device module integration.
• Familiarity with cleanroom protocols and safety procedures.
• Knowledge of basic semiconductor unit processes such as PVD, RIE, ICP, etc.
• Ability to work effectively as a team as well as independently.
• Intern/working experience in semiconductor manufacturing/R&D Fab will be considered a plus.
• Strong communication and teamwork skills.

As a University of Applied Learning, SIT works closely with industry in our research pursuits. Our research staff will have the opportunity to be equipped with applied research skill sets that are relevant to industry demands while working on research projects in SIT.

The Role

We are seeking a highly motivated and talented Research Fellow to join an exciting industry-funded applied research project within the Infocomm Technology cluster at SIT. This project addresses the critical challenge of enabling ultra-reliable low-latency communications (URLLC) with priority-aware offloading for public safety services.

The successful candidate will be responsible for the end-to-end investigation of novel edge-assisted computation offloading strategies that leverages edge intelligence. The role will bridge rigorous theoretical work with hands-on offloading algorithm design and development. The core responsibility is to build and validate these offloading strategies, complete with Python application programming interfaces (APIs), through rigorous simulations and proof-of-concept (PoC) trials.

This position is ideal for a researcher with a passion for solving complex problems at the intersection of wireless communications, edge computing, and machine learning, and who is eager to translate theoretical insights into practical systems.

Key Responsibilities

• Derive and analyse closed-form mathematical expressions for latency and offloading probabilities across edge-only, cloud-only, and edge-cloud computation offloading algorithms.
• Design and develop robust Python APIs for edge-only, cloud-only, and edge-cloud computation offloading algorithms.
• Set up network testbeds integrating hardware, software, and communication protocols to validate edge-only, cloud-only, and edge-cloud computation offloading algorithms.
• Conduct rigorous simulations and live PoC trials to ensure computation offloading algorithms meets URLLC targets for public safety services.
• Participate in and manage the research project with Principal Investigator (PI) to ensure all project deliverables are met.

Job Requirements

• A Ph.D./Master’s degree in Computer Engineering, Communications Engineering, Computer Science, or a highly related discipline.
• A strong theoretical foundation and research background in wireless communications and edge computing.
• Strong publication track record in top-tier conferences and journals in the areas of wireless communications, IoT, or edge computing.
• Demonstrated proficiency in software API and algorithm development of edge intelligence algorithms using Python.
• Knowledge of machine learning or reinforcement learning techniques is highly advantageous.
• Experience with theoretical wireless network modelling, particularly stochastic geometry or queuing theory, is highly advantageous.

Key Roles and Responsibilities

• Develop and optimize CMP process for silicon photonics, flat optics, advanced packaging, MEMS, and wide bandgap semiconductor applications.
• Collaborate with process integration teams to drive CMP process development, optimization, and troubleshooting for both industrial and grant-funded projects.
• Own innovation strategy for CMP raw materials, slurry, methodologies, and approaches to enhance CMP uniformity, stability and defect performance.
• Provide technical support to fab teams in implementing and sustaining statistical process control (SPC) for CMP modules, ensuring consistent process performance.
• Prepare and deliver technical reports and presentations for both internal stakeholders and external customers, effectively communicating project progress and technical insights.

Job Requirements

• Bachelors/Master's degree in Electronics, Microelectronics, Materials Engineering, Chemical Engineering, Materials Science, Chemistry, Physics, or equivalent.
• Minimum 3 years of experience in semiconductor industry, preferably in CMP technologies.
• Hands-on experience with 200 mm or 300 mm CMP equipment platforms (e.g., AMAT or Ebara) is highly desirable.
• Knowledge of silicon photonics, advanced packaging, MEMS, or wide bandgap semiconductor platforms is advantageous.
• Hands-on experience with basic process characterization techniques such as DRSEM, Ellipsometry, and AFM is a plus.
• Strong skills in experimental design (DOE), data analysis, and process optimization.
• Good analytical and communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.
• Self-motivated with a strong interest in advancing next-generation CMP applications and industry trends.

Job Responsibilities:

• Support developing and sustaining electroplating processes (Cu TSV/Damascene/ RDL/Pillar, UBM, micro-bump) in both R&D and small volume manufacturing environments.
• Support troubleshooting, root cause analysis for electroplating defects (e.g., voids, roughness, non-uniformity, adhesion issues).
• Design and perform DOEs to define process windows, characterize new requirements, and evaluate plating chemistries, technologies.
• Compile, analyse, and interpret test data to establish process specifications.
• Generate comprehensive technical reports for both internal teams and customers.
• Collaborate closely with senior engineers, process integrators, and cross-functional teams to align with technology roadmaps and process capability requirements.

Job Requirements

• Bachelor's or higher degree in Materials Science, Chemical Engineering, Chemistry, or related fields.
• Knowledge of electroplating process is a plus.
• Hands-on experiences in electroplating or related processes are preferred.
• Solid knowledge of experimental design (DOE), data analysis, and problem-solving methodologies (e.g., statistical analysis, root cause analysis).
• Excellent interpersonal, communication, and teamwork skills, with the ability to collaborate across disciplines.
• Self-motivated, resourceful, and capable of managing multiple priorities in a dynamic R&D setting.

Job Responsibilities:

• Support developing and sustaining electroplating processes (Cu TSV/Damascene/ RDL/Pillar, UBM, micro-bump) in both R&D and small volume manufacturing environments.
• Support troubleshooting, root cause analysis for electroplating defects (e.g., voids, roughness, non-uniformity, adhesion issues).
• Design and perform DOEs to define process windows, characterize new requirements, and evaluate plating chemistries, technologies.
• Compile, analyse, and interpret test data to establish process specifications.
• Generate comprehensive technical reports for both internal teams and customers.
• Collaborate closely with senior engineers, process integrators, and cross-functional teams to align with technology roadmaps and process capability requirements.

Job Requirements

• Bachelor's or higher degree in Materials Science, Chemical Engineering, Chemistry, or related fields.
• Knowledge of electroplating process is a plus.
• Hands-on experiences in electroplating or related processes are preferred.
• Solid knowledge of experimental design (DOE), data analysis, and problem-solving methodologies (e.g., statistical analysis, root cause analysis).
• Excellent interpersonal, communication, and teamwork skills, with the ability to collaborate across disciplines.
• Self-motivated, resourceful, and capable of managing multiple priorities in a dynamic R&D setting.

We have a few openings for Research Fellow or Research Engineer. The selected applicant is expected to lead and pursue high-quality research in applied artificial intelligence (e.g., data analytics and transfer learning) for battery management for rugged systems that lead to publications in top-tier international conferences and journals, as well as real-world implementations. If interested, please send your resume to ZHANG Wei (wei.zhang@singaporetech.edu.sg) including a cover letter, CV and a brief statement of your work undertaken in previous work.

The Singapore Institute of Technology (SIT) is a public autonomous university and the third largest university by intake in Singapore. SIT’s mission is to innovate with industry, through an integrated applied learning and research approach, so as to contribute to the economy and society. Singapore is the small city with a big dream. We are home to the best talent and have the world’s highest per capital investment in science and technology.

Key Responsibilities:

• Collaborate with partners from both the academia and the industry to lead and/or conduct innovative research on, but not limited to transfer learning, explainable machine learning, battery management, etc.
• Contribute to academic research in the relevant domains and publish high-tier journal papers and conference papers.
• Participate in and manage the research project with Principal Investigator (PI) to ensure all project deliverables are met.
• Coordinate procurement and liaison with vendors/suppliers.
• Participate in computer science related laboratories and tutorials for undergraduate students.
• Interview and supervise student assistants in the project.

Job Requirements:

• (Research Fellow) PhD in Computer Science or a related field
• (Research Engineer) Bachelor/Master degree in Computer Science or a related field
• Proven ability to conduct independent research with a relevant publication record
• Outstanding data analytics, mathematical, and computer modelling skills
• Excellent interpersonal communication and oral presentation skills in English
• Self-driven and strong team spirit
• Open to fixed-term contract (renewable upon review of satisfactory performance)

About the Role
We are looking for a Senior/Research Engineer who is eager to apply software development, and optimisation techniques to solve real-world challenges in manufacturing planning, scheduling, and inventory management. This is an excellent opportunity to grow your career by working on cutting-edge AI-powered applications that drive smarter and more autonomous manufacturing operations. 

Key Responsibilities
* Develop and maintain enterprise planning, scheduling, and inventory applications.
* Build scalable microservices and user-friendly interfaces using C# .NET and Angular.
* Apply Agentic AI technologies to enhance human-AI collaboration in planning and scheduling.
* Explore and implement optimisation methods for complex scheduling and resource allocation problems.
* Support deployment and monitoring of applications in production environments.
* Collaborate closely with senior engineers, researchers, and cross-functional teams.
* Document technical designs, code, and workflows for easy maintenance and knowledge sharing.
* Assist in troubleshooting, debugging, and improving performance for scalability and efficiency.

Job Requirements
* Bachelor's degree in AI, Computer Science, Engineering, or a related field.
* Minimum of 3 years of experience in software development.
* Strong programming skills in C# .NET and Angular.
* Good knowledge of manufacturing planning, scheduling, and inventory workflows.
* Familiarity with Generative AI and its applications in decision support systems.
* Basic understanding of optimisation algorithms for scheduling and resource management.
* Exposure to Docker, Kubernetes, CI/CD pipelines, and cloud/on-premises environments.
* Problem-solving mindset with strong analytical skills and attention to detail.
* Eager to learn, proactive, and collaborative with a positive attitude.
* Good communication skills for working effectively in a team environment.

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.

About the Role

We are looking for a Senior Research Engineer to design and implement AI-enabled solutions that support manufacturing planning, scheduling, and inventory analytics. You will work on building backend services, data pipelines, and APIs that connect AI systems with manufacturing platforms to enable smarter, data-driven decision-making.

Key Responsibilities

·       Lead the development and integration of applications for production planning, scheduling, and inventory optimization.

·       Design backend services and APIs to support planning and analytics workflows.

·       Orchestrate multiple AI-driven agents for collaborative task execution in manufacturing systems.

·       Connect AI applications with external manufacturing platforms and enterprise tools.

·       Collaborate with AI/ML engineers to deploy models into production.

·       Build scalable backend systems using Docker, Kubernetes, and cloud platforms.

·       Support CI/CD pipelines and maintain production/staging environments.

·       Contribute to evolving AI-based decision support platforms for manufacturing operations.

Requirements

·        Bachelor's degree in AI, Computer Engineering, Software Engineering, or related field.

·       Minimum of 5 years of experience in software development, focusing on enterprise systems.

·       Experience with microservices (C# .NET, Python) and using Angular.

·       Familiarity with AI-driven planning, scheduling, or inventory analytics.

·       Knowledge of agent-based systems or multi-agent coordination.

·       Proficiency with Docker, Kubernetes, and cloud environments.

·       Hands-on experience with CI/CD tools (Jenkins, GitHub, etc.).

·       Exposure to AI/ML model integration in production.

·       Excellent problem-solving, troubleshooting, and analytical skills, with a high level of attention to detail.

·       Strong verbal and written communication skills.

·       Positive, proactive attitude, with the ability to collaborate effectively across multiple stakeholders.

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.

About the Role

We are looking for a Senior Research Engineer to design and implement AI-enabled solutions that support manufacturing planning, scheduling, and inventory analytics. You will work on building backend services, data pipelines, and APIs that connect AI systems with manufacturing platforms to enable smarter, data-driven decision-making.

Key Responsibilities

·       Lead the development and integration of applications for production planning, scheduling, and inventory optimization.

·       Design backend services and APIs to support planning and analytics workflows.

·       Orchestrate multiple AI-driven agents for collaborative task execution in manufacturing systems.

·       Connect AI applications with external manufacturing platforms and enterprise tools.

·       Collaborate with AI/ML engineers to deploy models into production.

·       Build scalable backend systems using Docker, Kubernetes, and cloud platforms.

·       Support CI/CD pipelines and maintain production/staging environments.

·       Contribute to evolving AI-based decision support platforms for manufacturing operations.

Requirements

·        Master's degree in AI, Computer Engineering, Software Engineering, or related field.

·       Minimum of 8 years of experience in software development, focusing on enterprise systems.

·       Experience with microservices (C# .NET, Python) and using Angular.

·       Familiarity with AI-driven planning, scheduling, or inventory analytics.

·       Knowledge of agent-based systems or multi-agent coordination.

·       Proficiency with Docker, Kubernetes, and cloud environments.

·       Hands-on experience with CI/CD tools (Jenkins, GitHub, etc.).

·       Exposure to AI/ML model integration in production.

·       Excellent problem-solving, troubleshooting, and analytical skills, with a high level of attention to detail.

·       Strong verbal and written communication skills.

·       Positive, proactive attitude, with the ability to collaborate effectively across multiple stakeholders.

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.

Key Roles and Responsibilities

• Develop and optimize CMP process for silicon photonics, flat optics, advanced packaging, MEMS, and wide bandgap semiconductor applications.
• Collaborate with process integration teams to drive CMP process development, optimization, and troubleshooting for both industrial and grant-funded projects.
• Own innovation strategy for CMP raw materials, slurry, methodologies, and approaches to enhance CMP uniformity, stability and defect performance.
• Provide technical support to fab teams in implementing and sustaining statistical process control (SPC) for CMP modules, ensuring consistent process performance.
• Prepare and deliver technical reports and presentations for both internal stakeholders and external customers, effectively communicating project progress and technical insights.

Job Requirements

• Bachelors/Master's degree in Electronics, Microelectronics, Materials Engineering, Chemical Engineering, Materials Science, Chemistry, Physics, or equivalent.
• Minimum 3 years of experience in semiconductor industry, preferably in CMP technologies.
• Hands-on experience with 200 mm or 300 mm CMP equipment platforms (e.g., AMAT or Ebara) is highly desirable.
• Knowledge of silicon photonics, advanced packaging, MEMS, or wide bandgap semiconductor platforms is advantageous.
• Hands-on experience with basic process characterization techniques such as DRSEM, Ellipsometry, and AFM is a plus.
• Strong skills in experimental design (DOE), data analysis, and process optimization.
• Good analytical and communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.
• Self-motivated with a strong interest in advancing next-generation CMP applications and industry trends.

The Heterogeneous Integration Department at the Institute of Microelectronics (IME) is seeking a passionate and skilled Research Engineer or Senior Research Engineer to join our team. This role is pivotal in advancing state-of-the-art chip-to-wafer and wafer-to-wafer hybrid bonding processes, developing cutting-edge fabrication techniques for 2.5D and 3D packaging applications, and conducting electrical and reliability characterization. The position provides an exciting opportunity to contribute to groundbreaking technologies and collaborate with a dynamic team of researchers and external stakeholders.

Key Responsibilities

• Research and develop advanced fine-pitch flip-chip & hybrid bonding techniques for chip-to-wafer, emphasizing bonding parameter optimization and process enhancements.
• Interposer and Hybrid Bond pad fabrication for Flip Chip and Hybrid bonding applications
• Optimize Chip to wafer hybrid bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, and bonding methods.
• Conduct engineering experiments for process characterization to drive quality and yield improvements.
• Perform reliability characterization of flip-chip or hybrid-bonded packages to ensure robustness and long-term performance.
• Lead capability development projects with manageable risks and mentor less experienced colleagues.
• Collaborate with senior staff and principal investigators to develop process capability and new.
• Inspire and mentor talent in semiconductor technology, contributing to workforce development in the field.

Qualifications and Skills

Candidates should meet the following criteria:

• Educational Background: Bachelors in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field.
• Experience: 1 to 6 years of experience in microelectronic devices, circuits, and hybrid component integration, 2.5D/3D heterogenous integration applications.
• Technical Expertise: Hands-on experience in flip chip bonding is preferable
• Knowledge: Knowledge of hybrid bonding equipment technologies and bonding materials and methodologies, and reliability characterization is preferable, but not mandatory.
• Skills: Strong analytical and problem-solving skills. Proficiency in data analysis and interpretation and design of experiments.
• Excellent written and verbal communication abilities.
• Teamwork: Ability to work collaboratively in a research-oriented environment (OEMs, customers, and Internal stakeholders). Demonstrated ability to manage multiple tasks and projects simultaneously.
• Demonstrated expertise in heterogeneous integration, hybrid bonding, and advanced packaging processes.

What We Offer

• The opportunity to work on cutting-edge research in advanced packaging and heterogeneous integration.
• A collaborative and interdisciplinary work environment.
• Access to state-of-the-art facilities and resources.

Join us in shaping the future of semiconductor technologies and heterogeneous integration. Apply today!